MT9T031: 1/2-Inch 3-Mp Digital Image Sensor MT9T031 Image Sensor Product Brief Micron's MT9T031 is a QXGA-format 1/2-inch CMOS activepixel digital image sensor with an active imaging pixel array of 2048H x 1536V. It incorporates sophisticated camera functions on-chip such as windowing, column and row skip mode, and snapshot mode. It is programmable through a simple two-wire serial interface. The 3-megapixel CMOS image sensor features DigitalClarityTM--Micron's breakthrough low-noise CMOS imaging technology that achieves CCD image quality (based on signal-tonoise ratio and low-light sensitivity) while maintaining the inherent size, cost, and integration advantages of CMOS. Parameter Applications * High-resolution network cameras * Wide field of view cameras * Dome cameras with electronic pan, tilt, and zoom * Security video cameras with high resolution stills * Detailed feature extraction for smart cameras Features * Micron(R) DigitalClarity(R) imaging technology * High frame rate * Global reset release * Horizontal and vertical binning * Column and row skip modes * Superior low-light performance * Low dark current * Simple two-wire serial interface * Programmable controls: Gain, frame rate, frame size, exposure * Pin-for-pin compatible with Micron's 1.3-megapixel MT9M001 Ordering Information Part Number MT9T031P12STC MT9T031P12STCD ES MT9T031P12STCH ES Description 48-pin PLCC Demo kit Demo kit headboard Optical format Active imager size 1/2-inch (4:3) 6.55mm(H) x 4.92mm(V) 8.19 (diagonal) Active pixels 2048H x 1536V Pixel size 3.2m x 3.2m Color filter array RGB Bayer pattern Shutter type Global reset release (GRR), electronic rolling shutter (ERS) Maximum data rate/ 48 Mp/s/48 MHz master clock Frame rate QXGA (2048 x 1536) Programmable up to 12 fps UXGA (1600 x 1200) Programmable up to 20 fps HDTV (1280 x 720) Programmable up to 39 fps XGA (1024 x 768) Programmable up to 43 fps VGA (640 x 480) Programmable up to 93 fps ADC resolution 10-bit, on-chip Responsivity >1.0 V/lux-s (550nm) Dynamic range 61dB SNRMAX 43dB Supply voltage 3.0V-3.6V (3.3V nominal) Power consumption 228mW (nominal); 1.65W (standby) Operating temp 0C to 60C Packaging 48-pin PLCC Output gain 25 e-/LSB Read noise 6 e-RMS at 16X Dark current 100 e-/pixel/s at 55C (c)2006 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. MT9T031: 1/2-Inch 3-Mp Digital Image Sensor General Description General Description The MT9T031 produces extraordinarily clear, sharp digital pictures, and its ability to capture both continuous video and single frames makes it the perfect choice for a wide range of consumer and industrial applications, including high-resolution network cameras, electronic PTZ cameras, and security video cameras that can also produce high-resolution still images. The sensor can be operated in its default mode or programmed for frame size, exposure, gain setting, and other parameters. The default mode outputs a QXGA image at 12 frames per second (fps). An on-chip analog-to-digital converter (ADC) provides 10 bits per pixel. FRAME_VALID and LINE_VALID signals are output on dedicated pins, along with a pixel clock that is synchronous with valid data. Block Diagram Two-Wire Serial Interface Control Register Active-Pixel Sensor (APS) Array Timing and Control Analog Processing Clock Sync Signals 10-bit Data ADC Figure 2 illustrates the MT9T031's quantum efficiency in relation to wavelength. Figure 2: MT9T031 Quantum Efficiency 40 Blue Green Red Quantum Efficiency (%) 35 30 25 20 15 10 5 0 350 400 450 500 550 600 650 700 750 800 Wavelength (nm) PDF: 09005aef824c997f/Source: 09005aef824c998a MT9T031_3100_PB_2.fm - Rev. A 8/06 EN 1 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2006 Micron Technology, Inc. All rights reserved. Draft 8/ 31/ 2006 Figure 1: MT9T031: 1/2-Inch 3-Mp Digital Image Sensor General Description Figure 3: Typical Configuration (connection) VDD + VAA 0.01F 0.1F 0.1F AGND SCLK SDATA MASTER CLOCK EXTCLK TRIGGER GSHT_CTL DOUT[9:0] PIXCLK LINE_VALID FRAME_VALID STROBE + AGND STANDBY OE# TEST DGND RESET# 10F DGND Notes: AGND 1. Resistor value 1.5K is recommended, but resistance may be greater for slower two-wire speed. PDF: 09005aef824c997f/Source: 09005aef824c998a MT9T031_3100_PB_2.fm - Rev. A 8/06 EN NC DGND VDD NC NC VAAPIX AGND AGND SCLK SDATA NC DGND 48-Pin PLCC 6 5 4 3 2 1 48 47 46 45 44 43 STROBE NC 11 38 DGND GSHT_CTL 12 37 VDD OE# 13 36 DOUT[9] NC 14 35 DOUT[8] AGND 15 34 DOUT[7] VAA 16 33 DOUT[6] AGND 17 32 DOUT[5] AGND 18 31 PIXCLK 19 20 21 22 23 24 25 26 27 28 29 30 NC 39 EXTCLK 10 DOUT[4] LINE_VALID RESET# DOUT[3] 40 DOUT[2] 9 DOUT[1] FRAME_VALID NC DGND 41 DOUT[0] NC 8 VDD 42 TRIGGER AGND 7 VAA STANDBY NC Figure 4: VAAPIX TWO-WIRE SERIAL BUS VAA VDD DGND 2 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2006 Micron Technology, Inc. All rights reserved. Draft 8/ 31/ 2006 1.5K1 1K 1.5K1 2.2F MT9T031: 1/2-Inch 3-Mp Digital Image Sensor General Description Pin Descriptions Pin Numbers Symbol Type Description 7 STANDBY Input 8 10 TRIGGER RESET# Input Input 13 OE# Input 29 46 12 45 24, 25, 26, 27, 28, 32, 33, 34, 35, 36 31 EXTCLK SCLK GSHT_CTL SDATA DOUT[9:0] Input Input Input I/O Output Standby: Activates (HIGH) standby mode, disables analog bias circuitry for power saving mode. Trigger: Activates (HIGH) snapshot sequence. Reset: Activates (LOW) asynchronous reset of sensor. All registers assume factory defaults. Output enable: OE# when HIGH, places outputs DOUT[9:0], FRAME_VALID, LINE_VALID, PIXCLK, and STROBE into a tri-state configuration. Clock in: Master clock into sensor (48 MHz maximum). Serial clock: Clock for serial interface. Global shutter control. Serial data: Serial data bus, requires 1.5K resistor to 3.3V for pull-up. Data out: Pixel data output bit 0, DOUT[9] (MSB), DOUT[0] (LSB). PIXCLK Output 39 STROBE Output 40 LINE_VALID Output 41 1 FRAME_VALID VAAPIX Output Supply 4, 22, 37 5, 23, 38, 43 16, 20 15, 17, 18, 21, 47, 48 VDD DGND VAA AGND Supply Supply Supply Supply 2, 3, 6, 9, 11,14,19, 30 42, 44 NC - PDF: 09005aef824c997f/Source: 09005aef824c998a MT9T031_3100_PB_2.fm - Rev. A 8/06 EN Pixel clock: Pixel data outputs are valid during falling edge of this clock. Frequency = master clock. Strobe: Output is pulsed HIGH to indicate sensor reset operation of pixel array has completed. Line valid: Output is pulsed HIGH during line of selectable valid pixel data (see R0x20 for options). Frame valid: Output is pulsed HIGH during frame of valid pixel data. Analog pixel power: Provides power supply for pixel array, 3.3V 0.3V. Digital power: Provides power supply for digital block, 3.3V 0.3V. Digital ground: Provides isolated ground for digital block. Analog power: Provides power supply for analog block, 3.3V 0.3V. Analog ground: Provides isolated ground for analog block and pixel array. No connect: These pins must be left unconnected. 3 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2006 Micron Technology, Inc. All rights reserved. Draft 8/ 31/ 2006 Table. 3: MT9T031: 1/2-Inch 3-Mp Digital Image Sensor Feature Description Output Data Format The MT9T031 image data is read out in a progressive scan. Valid image data is surrounded by horizontal blanking and vertical blanking, as shown in Figure 5. Figure 5: Spatial Illustration of Image Readout P0,0 P0,1 P0,2.....................................P0,n-1 P0,n P1,0 P1,1 P1,2.....................................P1,n-1 P1,n 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 VALID IMAGE HORIZONTAL BLANKING 00 00 00 ..................................... 00 00 00 00 00 00 ..................................... 00 00 00 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 VERTICAL BLANKING VERTICAL/HORIZONTAL BLANKING 00 00 00 ..................................... 00 00 00 00 00 00 ..................................... 00 00 00 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 Feature Description Window Size The default programmed window size is 2,048 columns by 1,536 rows (2048H x 1536V), though the window size can be changed through the control logic. Table 4 shows examples of register settings that may be used to achieve various resolutions and frame rates. Table 4: Standard Resolutions Resolution 2048 x 1536 QXGA 1600 x 1200 UXGA 1280 x 1024 SXGA 1024 x 768 XGA 800 x 600 SVGA 640 x 480 VGA Table 5: Frame Rate Column_Size Row_Size Shutter Width 12 fps 20 fps 27 fps 43 fps 65 fps 93 fps 2047 1599 1279 1023 799 639 1535 1199 1023 767 599 479 <1552 <1216 <1040 <784 <616 <496 Frame Rate Column_Size Row_Size Shutter Width 18 fps 39 fps 1919 1279 1079 719 <1096 <736 Wide-Screen (16:9) Resolutions Resolution 1920 x 1080 HDTV 1280 x 720 HDTV Electronic Panning The location of the readout window can be changed. This enables a zooming function, since only a segment of the imager array is read out. Figure 6 on page 5 shows some examples of the electronic pan/zoom and windowing capabilities of the sensor. PDF: 09005aef824c997f/Source: 09005aef824c998a MT9T031_3100_PB_2.fm - Rev. A 8/06 EN 4 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2006 Micron Technology, Inc. All rights reserved. Draft 8/ 31/ 2006 Pm-1,0 Pm-1,1.....................................Pm-1,n-1 Pm-1,n 00 00 00 .................. 00 00 00 Pm,0 Pm,1.....................................Pm,n-1 Pm,n 00 00 00 .................. 00 00 00 MT9T031: 1/2-Inch 3-Mp Digital Image Sensor Feature Description Figure 6: Windowing Capabilities A B C Window Size Window A Window B Window C Window D 2048 x 1536 128 x 128 512 x 512 400 x 96 Blanking Control Registers control the blanking time in a row (called column fill-in or horizontal blanking) and between frames (vertical blanking). Horizontal blanking is specified in terms of pixel clocks. Vertical blanking is specified in terms of row readout times. Frame Time The user can change the number of columns and rows read out as well as the horizontal and vertical blanking times to obtain different frame rates. High Frame Rate Readout Modes In addition to having the flexibility to read out smaller standard formats, the sensor can also read out nonstandard formats. This is particularly useful for zooming in on a particular segment of the image to perform high-speed mathematical calculations (for example, a high-speed viewfinder or autofocus applications). Applications with an autofocus mode may require more horizontal than vertical resolution. That way, the imager can window to the midsection of the array by changing the row start address and the window height. The MT9T031change registers can obtain the different frame rates. The imager can also perform row skip modes to obtain a larger field of view when high-frequency vertical resolution is not critical. PDF: 09005aef824c997f/Source: 09005aef824c998a MT9T031_3100_PB_2.fm - Rev. A 8/06 EN 5 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2006 Micron Technology, Inc. All rights reserved. Draft 8/ 31/ 2006 D MT9T031: 1/2-Inch 3-Mp Digital Image Sensor Feature Description Pixel Integration Time Control Sensor integration time can be changed by adjusting the amount of time the pixels are set to collect charge generated from light. The sensor also supports sub-row integration time for fine control of pixel integration time. Note that not all integration times may be desired under certain lighting conditions. If the light source has a flicker component, then the integration time needs to be set properly to avoid banding in the image. Snapshot Mode and Flash Control Setting Up for Snapshot Mode There are two important signals used for snapshot mode: TRIGGER and STROBE. The TRIGGER signal initiates the start of a single-frame capture, and STROBE is an output pulse that may be used to turn on a flash and/or activate a mechanical shutter. An external trigger signal input allows the snapshot operation to begin after the TRIGGER pulse moves from a HIGH to LOW state. Alternately, an internal register can be set through the serial inteface. Strobe Pulse Output After the TRIGGER pulse has signaled a snapshot operation, each row of the imager array is reset in sequence to clear out any accumulated signal. Once each row of the imager is reset, the STROBE pulse is output from the imager Global Shutter Release Snapshot Mode In addition to the standard snapshot mode, the MT9T031 has a global shutter release mode which may be combined with a mechanical shutter to achieve simultaneous exposure of all rows in the image. Two global shutter modes are available: programmed exposure and bulb mode. Skip and Bin Modes Row and column skip modes use subsampling to reduce the output resolution without reducing the field of view. The MT9T031 also has row and column binning modes, which can reduce the impact of aliasing introduced by the use of skip modes. Both 2X and 3X binning modes are supported. Rows and columns can be binned independently. Smaller Format Resolution With the flexible windowing capability of the sensor, the user is able to read out different resolution formats from default of QXGA to UXGA, SXGA, XGA, SVGA, VGA, CIF, QVGA, QCIF, and so on. PDF: 09005aef824c997f/Source: 09005aef824c998a MT9T031_3100_PB_2.fm - Rev. A 8/06 EN 6 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2006 Micron Technology, Inc. All rights reserved. Draft 8/ 31/ 2006 Triggering a Snapshot MT9T031: 1/2-Inch 3-Mp Digital Image Sensor Feature Description Signal Path The MT9T031 sensor analog signal path consists of the pixel array, the column sample and hold (S/H) circuitry, the programmable gain stage, the analog offset correction, and the analog-to-digital converter (ADC). The reset and signal voltages from the pixel are sampled onto the column sample and hold circuitry by row. After signal sampling is complete, the differential signal (reset - signal) is transferred to the programmable gain stage. After the gain stage, the differential signal goes through the analog offset correction circuitry. The user can decide if a positive or negative offset or no offset needs to be added to the differential signal. The signal is then sampled onto the sample and hold circuitry of the ADC before being converted to a digital signal. Figure 7: Signal Path Pixel Voltage X Digital Offset (color-wise) + 10-bit ADC Analog Offset (color-wise) Black Level Calibration X + DOUT[9:0] Digital Gain (color-wise) Gain Settings The analog programmable gain stage consists of two stages of gain that operate in a pipelined manner. The first stage has programmable gain of 1 or 2 while the second stage has programmable gain of 1 to 4 with steps of 0.125, for a maximum analog gain of 8. The gain settings can be adjusted independently for the colors of green1, blue, red, and green2. Black Level Calibration The digital black level of the MT9T031 sensor potentially varies with temperature or gain setting changes. The MT9T031 sensor enables the flexibility of automatic black level calibration or manual black level control. Manual Black Level Calibration The programmable analog offset stage corrects for analog offset that might be present in the analog signal. The analog offset settings can be independently adjusted for the colors of green1, green2, red, and blue. Black Level Digital offset is applied such that the average black level of a frame in a resulting image equals the value of this register. This adjustment happens after black-level calibration. PDF: 09005aef824c997f/Source: 09005aef824c998a MT9T031_3100_PB_2.fm - Rev. A 8/06 EN 7 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2006 Micron Technology, Inc. All rights reserved. Draft 8/ 31/ 2006 Analog Gain (color-wise) MT9T031: 1/2-Inch 3-Mp Digital Image Sensor Serial Bus Description Serial Bus Description Registers are written to and read from the MT9T031 through the two-wire serial interface bus. The MT9T031 is a serial interface slave and is controlled by the serial clock (SCLK), which is driven by the serial interface master. Data is transferred into and out of the MT9T031 through the serial data (SDATA) line. Either the slave or master device can pull the SDATA line down--the serial interface protocol determines which device is allowed to pull the SDATA line down at any given time. Sequence If the request was a write, the master then transfers the 8-bit register address to which a write should take place. The slave sends an acknowledge bit to indicate that the register address has been received. The master then transfers the data 8 bits at a time, with the slave sending an acknowledge bit after each 8 bits. The MT9T031 uses 16-bit data for its internal registers, thus requiring two 8-bit transfers to write to one register. After 16 bits are transferred, the register address is automatically incremented so that the next 16 bits are written to the next register address. The master stops writing by sending a start or stop bit. A typical read sequence is executed as follows: 1. The master sends the write-node slave address and 8-bit address, just as in the write request. 2. The master sends a start bit and the read-mode slave address. 3. The master clocks out the register data 8 bits at a time. 4. The master sends an acknowledge bit after each 8-bit transfer. 5. The register address is auto-incremented after every 16 bits transferred. 6. The data transfer is stopped when the master sends a no-acknowledge bit. PDF: 09005aef824c997f/Source: 09005aef824c998a MT9T031_3100_PB_2.fm - Rev. A 8/06 EN 8 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2006 Micron Technology, Inc. All rights reserved. Draft 8/ 31/ 2006 A typical read or write sequence begins with the master sending a start bit. After the start bit, the master sends the slave device's 8-bit address. The last bit of the address determines if the request is a read or a write ("0" indicates a write and a "1" indicates a read). The slave device acknowledges its address by sending an acknowledge bit back to the master. MT9T031: 1/2-Inch 3-Mp Digital Image Sensor Electrical Specifications Electrical Specifications Table 6: DC Electrical Characteristics f Symbol Definition VDD VAA VAAPIX VIH VIL IIN Core digital voltage Analog voltage Pixel supply voltage Input high voltage Input low voltage Input leakage current VOH VOL IOH IOL IOZ IDD IAA IAAPIX ISTDBYD ISTDBYA ISTDBYDA Output high voltage Output low voltage Output high current Output low current Tri-state output leakage current Digital operating current Analog operating current Pixel supply current Digital standby current Analog standby current Pixel standby current Table 7: Condition Min Typ Max Units 3 3 3 - - -5 3.3 3.3 3.3 1.84 1.54 - 3.6 3.6 3.6 - - +5 V V V V V A 2.72 0.19 0 lux, 48 MHz 0 lux, 48 MHz 0 lux, 48 MHz Input clock disabled, 0 lux Input clock disabled, 0 lux Input clock disabled, 0 lux 2.54 0.13 - - - - - - - - - 2.82 0.3 11.5 12.5 5 23.0 54.0 5.0 2.0 2.0 1.0 V V mA mA A mA mA mA A A A Conditions Min Max Units -0.3 -0.3 -0.3 - - - - 0 -40 +3.6 +3.6 +3.6 1.9 29.5 56.3 6.4 60 +125 V V V V A A A C C No pull-up resistor; VIN = VDD or DGND At specified IOH = 0mA At specified IOL At specified VOH At specified VOL 20 45.0 4.0 0.2 0.2 0.1 Absolute Maximum Ratings Symbol Definition VDD_MAX VAA_MAX VAAPIX_MAX VIN_MAX IDD_MAX IAA_MAX IAAPIX_MAX TOP2 TST Core digital voltage Analog voltage Pixel supply voltage Input voltage Digital operating current Analog operating current Pixel supply current Operating temperature Storage temperature Notes: PDF: 09005aef824c997f/Source: 09005aef824c998a MT9T031_3100_PB_2.fm - Rev. A 8/06 EN Measured at junction 1. Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. To keep dark current and shot noise artifacts from impacting image quality, keep operating temperature at a minimum. 9 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2006 Micron Technology, Inc. All rights reserved. Draft 8/ 31/ 2006 EXTCLK = 48 MHz, VDD = 3.3V, VAA = 3.3V, VAAPIX = 3.3V, TA = 25C MT9T031: 1/2-Inch 3-Mp Digital Image Sensor Package Dimensions Package Dimensions Figure 8: 48-Pin PLCC 2.25 FOR REFERENCE ONLY D SUBSTRATE: PLASTIC LAMINATE MOLD COMPOUND: EPOXY NOVOLAC LID MATERIAL: BOROSILICATE GLASS 0.55 THICKNESS SEATING PLANE 13.00 CTR 7.188 0.075 OPTICAL CENTER A 11.176 47X 0.90 1.016 TYP 1.90 48 C B 0.078 FOR REFERENCE ONLY OPTICAL CENTER 1 48X 0.50 6.176 0.075 OPTICAL CENTER 6.56 7.11 0.05 14.220 0.075 1.016 TYP 5.588 0.934 FOR REFERENCE ONLY PACKAGE CENTER CL 1.050 0.075 5.588 6.56 7.11 0.05 14.220 0.075 LEAD FINISH: GOLD PLATING, 0.50 MICRONS MINIMUM THICKNESS OPTICAL AREA DIE AND PACKAGE CENTER 0.500 FOR REFERENCE ONLY 1.200 0.075 MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES B AND C : 1 MAXIMUM TILT OF OPTICAL AREA RELATIVE TO SEATING PLANE A : 50 MICRONS MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER GLASS D : 50 MICRONS Notes: PDF: 09005aef824c997f/Source: 09005aef824c998a MT9T031_3100_PB_2.fm - Rev. A 8/06 EN 1. All dimensions in millimeters. 10 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2006 Micron Technology, Inc. All rights reserved. Draft 8/ 31/ 2006 13.00 CTR CL 11.176 MT9T031: 1/2-Inch 3-Mp Digital Image Sensor Revision History Revision History Draft 8/ 31/ 2006 Rev. A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8/06 * Initial release (R) 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992 Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range for production devices. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. PDF: 09005aef824c997f/Source: 09005aef824c998a MT9T031_3100_PB_2.fm - Rev. A 8/06 EN 11 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2006 Micron Technology, Inc. All rights reserved.